Hey everyone, hoping someone can help me out here. I just got an Arducam IMX708 camera module (SKU B031202) for my Raspberry Pi 5, and I’m trying to use a sensor extension cable with it. The quick start guide and tutorials all show the sensor module being detachable from the main board — like it just pops off. But mine seems… not like that at all.
I’ve inspected the whole thing carefully. No screws, no latches, nothing obvious holding it. But the sensor assembly feels like it’s bonded or glued directly to the PCB. I’ve tried gentle manual force to lift it off and it won’t budge. I don’t want to yank on it and destroy the board or the sensor.
Anyone else run into this? Is this normal or did I get a unit that’s permanently attached? The tutorial makes it look trivially easy but that’s not matching what’s in my hands.
This is actually expected behavior, and you’re right to be cautious about applying too much force.
The sensor assembly base on the IMX708 (B031202) is secured at the factory with adhesive to prevent it from coming loose during shipping and vibration. Even though the module is electrically designed to be detachable — that’s the whole point, so you can use extension cables — the factory applies glue to keep everything solid until you’re ready to separate it.
Here’s what I’d recommend:
Apply low heat — Use a heat gun or a regular hair dryer to gently warm the area where the sensor assembly meets the main PCB. This softens the adhesive.
Temperature warning — Keep it strictly below 50°C (122°F). Don’t overdo it. Excessive heat can permanently deform the plastic lens housing or damage the sensor itself.
Lift gently — Once the glue softens, the entire sensor cube should come free with gentle upward force. Don’t pry aggressively.
After that, you can insert the extension cable between the sensor module and the base board as intended. The bond is adhesive-based, not permanent — it just needs a little encouragement.
Okay, I’m a bit confused now and need some clarity before I proceed with anything.
I reached out through a couple of channels and got completely opposite answers. One person (from sales) told me the sensor is NOT intended to be removed and advised against it entirely. But the support side is saying heat-assisted removal under 50°C is the way to go and it’s totally fine for this SKU.
That’s a pretty big contradiction. One says “don’t do it” and the other says “here’s how to do it.”
Before I put a heat gun anywhere near this camera, can I get a definitive answer — is the <50°C heat-assisted removal officially supported for SKU B031202? I don’t want to void anything or break a module based on conflicting info.
Totally understand the confusion — let me clear that up.
The conflicting guidance you received stems from differences between camera models, and unfortunately the distinction wasn’t communicated clearly.
Here’s the breakdown:
Model B0484: The sensor is permanently bonded to the board. It cannot be easily removed. If someone told you not to remove the sensor, they were likely thinking of this model.
Model B031202 (your unit): The sensor module and camera board are held together by a thin layer of double-sided tape — not structural epoxy or permanent bonding. It is mechanically viable to separate them.
So the heat-assisted removal procedure I described earlier (<50°C, hair dryer or heat gun, gentle lift) is the correct approach for your SKU. I’ve attached photos that confirm what the tape-bonded assembly looks like after separation.
A few important caveats:
Warranty: Manual modification carries risk. Any physical damage to the connector or sensor during removal is not covered under warranty. If the flex cable tears or the connector breaks, replacement won’t be offered. So take it slow.
Future purchases: If you have projects that require frequent disassembly or sensor extensions, you can contact Sales and specifically request units shipped “without sensor adhesive.” This can be done from the factory as a custom order — just ask for it upfront next time.
I followed the guidance and unfortunately the results are not good. I need to report what actually happened because it doesn’t match what was described here at all.
The adhesive on my unit was not a thin layer of double-sided tape. It was extremely strong — way beyond what anyone would describe as “tape.” I applied low heat exactly as instructed, kept it well under 50°C, and what I found after separation was not what the support photos showed for a tape-bonded unit.
Here’s the frustrating part: the mechanical condition of my sensor assembly after removal matches exactly the photo that support provided as an example of a sensor that should NOT be easily removable — the permanently bonded case. The unit described to me as “tape-bonded and removable” behaved identically to what was described as a permanently bonded variant.
One module is now damaged.
None of these bonding differences — light tape vs. the strong adhesive I encountered — were communicated beforehand. There’s nothing on the product page, in the documentation, or in the tutorials that indicates this variability exists. Arducam publishes sensor extension adapter guides that imply removability, but the actual hardware in my hands tells a different story.
Here’s a photo of what my unit looks like after removal:
I still have three other IMX708 cameras that haven’t been touched yet. Before I do anything else, I need clear guidance:
Can the remaining three unmodified IMX708 units be returned or exchanged for a version that’s actually designed to be safely separated?
What I really need is an IMX708-based camera with wide-angle optics equivalent to the B0484 cameras (~100° H / 72° V), that is explicitly manufactured without strong adhesive and intended for safe sensor removal, compatible with the Camera Module 3 sensor extension cables, and clearly differentiated from permanently bonded variants.
I’m using the Arducam Quad-Camera HAT (SKU B0484) — I need confirmation that any customized camera would be fully compatible with that HAT.
At this point I’ve lost time, effort, and a module based on guidance that didn’t match the hardware I received.
Thank you for the detailed report and the photo — I can see the issue clearly now, and I want to acknowledge that what you encountered does not align with what was described.
The bonding you’re showing in that image does appear consistent with a much stronger adhesive application than what we’d expect on a B031202 unit with standard double-sided tape. This suggests there may be manufacturing variability in the adhesive application on some batches — something that should have been caught and communicated, and clearly wasn’t.
Let me address your points directly:
Regarding the three remaining unmodified units:
I would not recommend attempting the removal procedure on those given what happened with your first unit. I’ve sent you a private message with options for returning or exchanging those — please check your messages.
Regarding the customized solution you need:
What you’re describing — an IMX708 with wide-angle optics, no adhesive, explicitly designed for sensor extension cable use with the Quad-Camera HAT — is something that can be arranged as a factory custom order. I’ve sent you the details privately on how to request this, including the specific instructions to provide so the units are manufactured without adhesive from the start.
Regarding Quad-Camera HAT (B0484) compatibility: electrically, an IMX708 sensor module connected via the standard Camera Module 3 extension cable interface should be compatible with the HAT, but I want to verify a few specifics about your setup before giving a blanket confirmation. I’ll follow up on that in the private message as well.
This situation has highlighted a real gap in how we communicate bonding differences across SKUs and batches. I’m escalating this internally so the product pages and tutorials can be updated to reflect the reality that not all B031202 units may have the same adhesive characteristics, and that attempting removal carries risk that should be clearly disclosed upfront.
